Semiconductor wafer dicing saw



FIG. 1 is a top, left front perspective view of a semiconductor wafer dicing saw showing our new design;

FIG. 2 is a right side elevational view thereof, the left side view being a mirror image;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a top, left perspective view of a second embodiment of FIG. 1, the difference being inclusion of a camera, blade housing and chuck;

FIG. 7 is a top plan view of FIG. 6;

FIG. 8 is a right side elevational view of FIG. 6;

FIG. 9 is a left side elevational view of FIG. 6;

FIG. 10 is a bottom plan view of FIG. 6; and,

FIG. 11 is a rear elevational view of FIG. 6.

The broken line showing of camera, blade housing and chuck in FIGS. 1-3 and 5 is for illustrative purposes only and forms no part on the claimed design for the embodiment of FIGS. 1-5. 

The ornamental design for a semiconductor wafer dicing saw, as shown and described. 